AMD CHAPTER 11 DIE AND WAFER SHIPMENTS Manual
This document introduces the packaging options for AMD die and wafers, including Waffle Pack, Surftape and Reel, GEL-PAK Die Tray, Wafer Jar, GEL-PAK Wafer Tray
Brand: AMD
File format: PDF
Size: 1519 KB
MD5 Checksum: BCC5DC47EB3D4D874BBF2B8451FFD269
Publication date: 27 January, 2012
Downloads: -
PDF Link: AMD CHAPTER 11 DIE AND WAFER SHIPMENTS Manual PDF