AMD CHAPTER 11 DIE AND WAFER SHIPMENTS Manual

This document introduces the packaging options for AMD die and wafers, including Waffle Pack, Surftape and Reel, GEL-PAK Die Tray, Wafer Jar, GEL-PAK Wafer Tray


Brand: AMD

File format: PDF

Size: 1519 KB

MD5 Checksum: BCC5DC47EB3D4D874BBF2B8451FFD269

Publication date: 27 January, 2012

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